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AssigneesOsaka Municipal Government, Matsushita Electric Industrial Co., Ltd., C. Uyemura & Co., Ltd.
InventorsMasanobu Izaki, Hiroshi Hatase, Yoshikazu Saijo
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A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/μm2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.
A substrate having a non-conductive portion to be electroless-plated, on the surface of which metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adsorb at a nuclei density of 2000 nuclei/μm2 or more;
A modified zinc oxide film which is modified from a zinc oxide film by treating said zinc oxide film with a modifier composed of a water solution containing trivalent cations, and heating said zinc oxide film thus treated,
Dependencies are inferred from the claim text.