Plasma processing method
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKiyoshi Arita, Tetsuhiro Iwai, Shoji Sakemi
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AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKiyoshi Arita, Tetsuhiro Iwai, Shoji Sakemi
Estimating the term…
A method of plasma processing a silicon-containing object to be processed at a high etching rate without causing a surface of the object to have a hazy appearance, so that this surface can have an excellent visual quality. In the plasma processing method of etching the surface of the semiconductor wafer, gas containing sulfur hexafluoride and helium is used as a plasma-generating gas. A fluorine radical as an active substance which reacts with silicon of the surface of the semiconductor wafer, gaseous silicon tetrafluoride yielded by the reaction and a compound (SFn) of fluorine and sulfur that is generated as a reaction product are removed by the helium gas functioning as carrier gas. The helium gas prevents the reaction product from adhering to the surface of the wafer again.
A plasma-processing method for forming a mirror-like etched surface on an object, said method comprising:
Dependencies are inferred from the claim text.