Method of forming an optical fiber interconnect through a semiconductor wafer
AssigneeMicron Technology, Inc.
InventorsJoseph E. Geusic, Kie Y. Ahn, Leonard Forbes
Life of this patent
Estimating the term…
Abstract
An integrated circuit with a number of optical fibers that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical fibers include a cladding layer and a core formed in the high aspect ratio hole. These optical fibers are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.
Claims34
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming the first functional circuit on a first surface of a semiconductor substrate;
- forming a hole through the semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole, the core having a core hole running through the core;
- and
- interconnecting the first and the second functional circuits together via the optical fiber.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming the first functional circuit on a first surface of a semiconductor substrate;
- forming a hole through the semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, wherein forming the hole comprises forming an etch pit at a selected location of the first surface of the semiconductor substrate, and performing an anode etch of the semiconductor substrate such that the hole is formed at the location of the etch pit.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming the first functional circuit on a first surface of a semiconductor substrate;
- forming a hole through the semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, wherein forming the optical fiber comprises forming a core with a core hole, the core hole running substantially along the center of the optical fiber.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming the first functional circuit on a first surface of a semiconductor substrate;
- forming a hole through the semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, further comprising lining the hole with a reflecting mirror prior to forming the cladding layer.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a semiconductor substrate;
- forming a second functional circuit on a second surface of the semiconductor substrate, the second surface of the semiconductor substrate being opposite the first surface;
- forming a hole through the semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole, the core having a core hole running through the core;
- and
- interconnecting the first and the second functional circuits together via the optical fiber.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a semiconductor substrate;
- forming a second functional circuit on a second surface of the semiconductor substrate, the second surface of the semiconductor substrate being opposite the first surface;
- forming a hole through the semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, wherein forming the hole comprises forming an etch pit at a selected location of the first surface of the semiconductor substrate, and performing an anode etch of the semiconductor substrate such that the hole is formed at the location of the etch pit.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a semiconductor substrate;
- forming a second functional circuit on a second surface of the semiconductor substrate, the second surface of the semiconductor substrate being opposite the first surface;
- forming a hole through the semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, wherein forming the optical fiber comprises forming a core with a core hole, the core hole running substantially along the center of the optical fiber.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a semiconductor substrate;
- forming a second functional circuit on a second surface of the semiconductor substrate, the second surface of the semiconductor substrate being opposite the first surface;
- forming a hole through the semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, further comprising lining the hole with a reflecting mirror prior to forming the cladding layer.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate;
- forming a second functional circuit on a first surface of a second semiconductor substrate;
- forming a hole through the first semiconductor substrate;
- bonding the first and the second semiconductor substrates together;
- forming an optical fiber having a cladding layer and a core in the hole, the core having a core hole running through the core;
- and
- interconnecting the first and the second functional circuits together via the optical fiber.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate;
- forming a second functional circuit on a first surface of a second semiconductor substrate;
- forming a hole through the first semiconductor substrate;
- bonding the first and the second semiconductor substrates together;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, wherein forming the hole comprises forming an etch pit at a selected location of the first surface of the first semiconductor substrate, and performing an anode etch of the first semiconductor substrate such that the hole is formed at the location of the etch pit.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate;
- forming a second functional circuit on a first surface of a second semiconductor substrate;
- forming a hole through the first semiconductor substrate;
- bonding the first and the second semiconductor substrates together;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, wherein forming the optical fiber comprises forming a core with a core hole, the core hole running substantially along the center of the optical fiber.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate;
- forming a second functional circuit on a first surface of a second semiconductor substrate;
- forming a hole through the first semiconductor substrate;
- bonding the first and the second semiconductor substrates together;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, further comprising lining the hole with a reflecting mirror prior to forming the cladding layer.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate, the first semiconductor substrate also having a second surface opposite the fast surface;
- forming a second functional circuit on a first surface of a second semiconductor substrate, the second semiconductor substrate also having a second surface opposite the first surface;
- forming a first hole through the first semiconductor substrate;
- forming a second hole through the second semiconductor substrate;
- bonding the second surface of the first semiconductor substrate to the second surface of the second semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the first and the second holes, the core having a core hole running through the core;
- and
- interconnecting the first and the second functional circuits together via the optical fiber.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate, the first semiconductor substrate also having a second surface opposite the first surface;
- forming a second functional circuit on a first surface of a second semiconductor substrate, the second semiconductor substrate also having a second surface opposite the first surface;
- forming a first hole through the first semiconductor substrate;
- forming a second hole through the second semiconductor substrate;
- bonding the second surface of the first semiconductor substrate to the second surface of the second semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the first and second holes;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, wherein forming the first hole includes forming an etch pit at a selected location of the first surface of the first semiconductor substrate and performing an anode etch of the first semiconductor substrate to form the first hole at the location of the etch pit, and forming the second hole includes forming a second etch pit at a selected location of the first surface of the second semiconductor substrate and performing an anode etch of the second semiconductor substrate to film the second hole at the location of the second etch pit.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate, the first semiconductor substrate also having a second surface opposite the first surface;
- forming a second functional circuit on a first surface of a second semiconductor substrate, the second semiconductor substrate also having a second surface opposite the first surface;
- forming a first hole through the first semiconductor substrate;
- forming a second hole through the second semiconductor substrate;
- bonding the second surface of the first semiconductor substrate to the second surface of the second semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the first and the second holes;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, further comprising lining the first and the second holes with a reflecting mirror prior to forming the cladding layer.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate, the first semiconductor substrate also having a second surface opposite the first surface;
- forming a second functional circuit on a first surface of a second semiconductor substrate, the second semiconductor substrate also having a second surface opposite the first surface;
- forming a hole through the first semiconductor substrate;
- bonding the second surface of the first semiconductor substrate to the first surface of the second semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole, the core having a core hole running through the core;
- and
- interconnecting the first and the second functional circuits together via the optical fiber.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate, the first semiconductor substrate also having a second surface opposite the first surface;
- forming a second functional circuit on a first surface of a second semiconductor substrate, the second semiconductor substrate also having a second surface opposite the first surface;
- forming a hole through the first semiconductor substrate;
- bonding the second surface of the first semiconductor substrate to the fist surface of the second semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, wherein forming the hole includes forming an etch pit at a selected location of the first surface of the first semiconductor substrate, and performing an anode etch of the first semiconductor substrate to form the hole at the location of the etch pit.
A method of forming an electronic system, the electronic system including a first functional circuit interconnected to a second functional circuit, comprising:
- forming a first functional circuit on a first surface of a first semiconductor substrate, the first semiconductor substrate also having a second surface opposite the first surface;
- forming a second functional circuit on a first surface of a second semiconductor substrate, the second semiconductor substrate also having a second surface opposite the first surface;
- forming a hole through the first semiconductor substrate;
- bonding the second surface of the first semiconductor substrate to the first surface of the second semiconductor substrate;
- forming an optical fiber having a cladding layer and a core in the hole;
- and
- interconnecting the first and the second functional circuits together via the optical fiber, further comprising lining the hole with a reflecting mirror prior to forming the cladding layer.
Dependencies are inferred from the claim text.