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AssigneeInternational Business Machines Corporation
InventorsRichard Ronald Hall, How Tzu Lin, Christopher John Majka, Norman Corey Seastrand, Matthew Francis Seward, Ronald Verne Smith
Estimating the term…
A multi-layer electronic structure includes an increased capacity for the attachment of active or passive devices thereto. This is achieved by creating a three-dimensional grid of connection points to electrically couple active or passive surface mounted devices to edge mounted devices. The grid pattern is useful with any laminate including circuit cards, ceramic modules and flexible circuits. The variety of electrical devices that may be connected to the cross-sectional substrate includes, but is not limited to, chips such as semiconductor chips, diodes, resistors, capacitors and printed wiring boards. The structure can be used to more rapidly pass data, such as optical data that is transmitted from a spectroscope through a VCSEL laser and the electronic structure to a computer for diagnostics and analysis. A stepped arrangement of circuitized laminates is described for this purpose.
An electronic sub assembly comprising a circuitized laminated substrate having top and bottom surfaces, and at least one beveled edge surface between said top and bottom surfaces, at least one active or passive device mounted on said at least one beveled edge surface, at least one other active or passive device mounted on at least one of the top and bottom surfaces, a conductive lead embedded in the substrate electrically connected to the active or passive device mounted on said at least one edge surface, the conductive lead also electrically connected to the at least one other active or passive device on the top or bottom surface.
A printed circuit board having two spaced apart, generally parallel surfaces comprising a top surface and a bottom surface, a beveled edge surface between said top and bottom surfaces, a plurality of conductive leads embedded in the circuit board parallel to the top and bottom surfaces and terminating in one or more connection points along the beveled edge surface, an active or passive device mounted on said edge surface and electrically joined through at least one of said connection points to at least one of the conductive leads, and at least one other active or passive device mounted on the top or bottom surface electrically joined through one of said conductive leads to the edge mounted device.
Dependencies are inferred from the claim text.