Memory module having balanced data I/O contacts pads

A computer system comprising:

• a processor;
• a memory controller coupled to said processor through a system bus;
• a memory bus coupled to said memory controller;
• a main memory subsystem coupled to said memory bus, said main memory subsystem comprising:
• at least one memory module coupled to said memory bus, wherein said at least one memory module includes:
• a printed circuit board having a first side and a second side, wherein said printed circuit board includes a connector edge adapted for insertion within a socket of said computer system, the connector edge having a plurality of contact pads on said first side and said second side of said printed circuit board;
• and
• a plurality of memory chips mounted on said printed circuit board;
• wherein said plurality of contact pads includes power contact pads configured to convey power, ground contact pads configured to convey ground and data signal contact pads configured to convey data bits for storage within said plurality of memory chips;
• wherein said power and ground contact pads alternate along each side of said connector edge, wherein at least one of said ground contact pads is between every two of said power contact pads to form adjacent power and ground contact pad pairs;
• and
• wherein all of said data signal contact pads are arranged between given adjacent power and ground contact pad pairs such that exactly four of said data signal contact pads are arranged between any of said given adjacent power and ground contact pad pairs.

A memory module for memory expansion in a computer system, the memory module comprising:

• a printed circuit board having a first side and a second side, wherein said printed circuit board includes a connector edge adapted for insertion within a socket of said computer system, the connector edge having a plurality of contact pads on said first side and said second side of said printed circuit board;
• and
• a plurality of memory chips mounted on said printed circuit board;
• wherein said plurality of contact pads includes evenly spaced power and ground contact pads in an alternating arrangement and data signal contact pads configured to convey data bits for storage within said plurality of memory chips;
• wherein at least one of said ground contact pads separates every two of said power contact pads;
• and
• wherein all of said data signal contact pads are arranged between given pairs of power and ground contact pads that have no other intervening power or ground contact pads such that exactly four of said data signal contact pads are arranged between any of said given pairs of power and ground contact pads.

A memory module for memory expansion in a computer system, said memory module comprising:

• a printed circuit board having a first side and a second side, wherein said printed circuit board includes a connector edge adapted for insertion within a socket of said computer system, the connector edge having a plurality of contact pads on said first side and said second side of said printed circuit board;
• and
• a plurality of memory chips mounted on said printed circuit board;
• wherein said plurality of contact pads includes power contact pads configured to convey power, ground contact pads configured to convey ground and data signal contact pads configured to convey data bits for storage within said plurality of memory chips;
• wherein said power and ground contact pads alternate along each side of said connector edge, wherein at least one of said ground contact pads is between every two of said power contact pads to form adjacent power and ground contact pad pairs;
• and
• wherein all data signal contact pads of said connector edge are arranged such that for any adjacent power and ground contact pad pair that includes an intervening data contact pad, exactly four of said data signal contact pads are provided therebetween.