Cooling hood for circuit board
AssigneeInfineon Technologies AG
InventorsThoai-Thai Le, Guenter Gerstmeier, David SuitWai Ma, Tao Wang
Life of this patent
Estimating the term…
Abstract
A cooling hood for a circuit board is provided. The circuit board includes at least one semiconductor device. The cooling hood includes a duct mounted onto the circuit board and surrounding at least a portion of the semiconductor device. The duct forms an inlet and an outlet. A cooling medium enters the duct through the inlet and exits the duct through the outlet.
Claims21
A cooling hood for a circuit board, the circuit board comprising at least one semiconductor device, the cooling hood comprising:
- a duct mounted onto the circuit board and covering at least a portion of the semiconductor device, the duct being configured to channel a flow of a cooling medium across the semiconductor device and having a first side and a second side, the first side defining a first edge and the second side defining a second edge;
- a flexible sealing element being configured to seal the duct to the circuit board to prevent leakage of the cooling medium from the duct, the flexible sealing element being disposed between the circuit board and the first edge and the circuit board and the second edge;
- an inlet;
- and
- an outlet.
A cooling hood for a circuit board, the circuit board comprising a plurality of semiconductor devices, the cooling hood comprising:
- a first duct mounted adjacent the circuit board and covering a plurality of semiconductor devices, wherein the duct forms an inlet and an outlet, the first duct being configured to channel a flow of a cooling medium across the semiconductor devices and having a first side and a second side, the first side defining a first edge and the second side defining a second edge;
- a flexible sealing element being configured to seal the duct to the circuit board to prevent leakage of the cooling medium from the duct, the flexible sealing element being mounted between the circuit board and the first edge and the circuit board and the second edge;
- and
- a housing separate from and covering the first duct.
A method for cooling a semiconductor device mounted on a circuit board, the method comprising:
- mounting a duct onto the circuit board, the duct covering at least a portion of the semiconductor device and forming an inlet and an outlet, and having a first side and a second side, the first side defining a first edge and the second side defining a second edge;
- sealing the duct to the circuit board with a flexible sealing element configured to seal the duct to the circuit board to prevent leakage of the cooling medium from the duct, the flexible sealing element being disposed between the circuit board and the first edge and the circuit board and the second edge;
- and
- flowing a cooling medium through the duct.
Dependencies are inferred from the claim text.