Sole structure for electrostatic dissipative footwear and method of making same

An electrostatic circuit for a sole having an outsole, an insole and a midsole positioned between the insole and outsole, said electrostatic circuit comprising:

• a first substrate having a first end and a second end;
• at least one conductor path attached to said first substrate, each said conductor path having a first exposed end adjacent said first end of said first substrate and being attachable to the outsole and a second exposed end adjacent said second end of said first substrate and attachable to the insole;
• at least one resistor electrically coupled to each said conductor path and mounted to said first substrate;
• a first conductive attachment pad assembly attached to said first end of said substrate;
• and
• a second conductive attachment pad assembly attached to said second end of said substrate.

An electrostatic circuit for a sole having a conductive outsole, a conductive insole and a nonconductive midsole between the insole and outsole, said electrostatic circuit comprising:

• a first substrate having first and second surfaces and a first end and a second end;
• a first conductor path printed on said first surface of said first substrate such that an entire length of each said first conductor path is completely supported on said first surface of said first substrate, said first conductor path having a first exposed end adjacent said first end of said first substrate and being attachable to the conductive outsole and a second exposed end adjacent said second end of said first substrate and attachable to the conductive insole;
• a first resistor supported on said first surface of said first substrate and electrically coupled to said first conductor path;
• a second conductor path printed on said first surface of said first substrate such that an entire length of each said second conductor path is completely supported on said first surface of said first substrate, said second conductor path having a first exposed end adjacent said first end of said first substrate and being attachable to the conductive outsole and a second exposed end adjacent said second end of said first substrate and attachable to the conductive insole;
• a second resistor supported on said first surface of said first substrate and electrically coupled to said second conductor path;
• a third conductor path printed on said first surface of said first substrate, said third conductor path having a first exposed end adjacent said first end of said first substrate and being attachable to the conductive outsole and a second exposed end adjacent said second end of said substrate and attachable to the conductive insole;
• and
• a third resistor supported on said first surface of said first substrate and electrically coupled to said third conductor path.

A sole for a conductive shoe, said sole comprising:

• an outsole;
• a midsole adjacent said outsole;
• an insole adjacent said midsole;
• and
• a printed circuit comprising:
• a first substrate having a first surface;
• at least one conductor path printed on said first surface of said first substrate such that an entire length of each said conductor path is completely supported on said first surface of said first substrate, each said conductor path having a first end attached to said outsole and a second end attached to said insole;
• and
• at least one resistor electrically coupled to each said conductor path and mounted to said first substrate.

A sole for a conductive shoe, said sole comprising:

• an outsole having an electrical resistance value of less than 1×106 ohms;
• a midsole adjacent said outsole and having an electrical resistance value of greater than 1×107 ohms;
• an insole adjacent said midsole and having an electrical resistance value of less than 1×106 ohms;
• and
• a printed circuit comprising:
• a first substrate having a first surface and first and second ends;
• at least one conductor path printed on said first surface of said first substrate such that an entire length of each said conductor path is completely supported on said first surface of said first substrate, each said conductor path having a first end attached to said outsole and a second end attached to said insole;
• and
• at least one resistor electrically coupled to each said conductor path and mounted to the first substrate.

A sole for an item of footwear, said sole comprising:

• an outsole having a predetermined electrical impedance;
• a midsole adjacent to said outsole and having a predetermined electrical impedance that is greater than said predetermined electrical impedance of said outsole;
• an insole adjacent said midsole and having a predetermined electrical impedance that is less than said predetermined electrical impedance of said midsole;
• a first substrate having first and second surfaces and first and second ends, said first substrate extending between said outsole and said insole;
• a conductor printed on said first surface of said first substrate and having one end attached to said outsole and another end attached to said insole;
• and
• a resistor attached to said conductor.

A method for applying a desired amount of electrical impendence to an electrostatic current passing through a shoe having an outsole, an insole and a midsole between the outsole and insole, said method comprising:

• printing a first conductive path entirely on a first surface of a substrate;
• affixing one end of a the first conductive path to the outsole;
• electrically coupling a first resistor having the desired amount of impedance to the conductive path;
• and
• affixing another end of the first conductive path to the insole.

A method for applying a desired amount of electrical impendence to an electrostatic current passing through a shoe having an outsole, an insole and a midsole between the outsole and insole, said method comprising:

• affixing one end of a first conductive path to a first conductive pad;
• affixing the first conductive pad to the outsole;
• electrically coupling a first resistor having the desired amount of impedance to the conductive path;
• affixing another end of the first conductive path to a second conductive pad;
• and
• affixing the second conductive pad to the insole.

A method of manufacturing a sole for a conductive shoe, comprising:

• affixing a first conductive path to a first surface of a substrate such that the first conductive path is completely received on the first surface and has a first exposed end and a second exposed end;
• attaching a first resistor to the first conductive path;
• forming a conductive outsole;
• forming a non-electrically conductive midsole;
• supporting the nonelectrically conductive midsole on the electrically conductive outsole;
• forming an electrically conductive insole;
• attaching the electrically conductive insole to the non-electrically conductive midsole;
• and
• supporting the substrate within the midsole such that the first exposed end of the first conductive path is in electrical contact with the electrically conductive outsole and the second end of the first electrically conductive path is in electrical contact with the electrically conductive insole.