Method and apparatus for evaluating insulating film
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsKoji Eriguchi, Yukiko Hashimoto, Akio Watakabe
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Abstract
There is provided a method for evaluating an insulating film entirely provided on a conductor layer for the characteristics or dimensions thereof. A measuring member having conductor bumps arranged thereon to be connected to wires is disposed above the insulating film on the conductor layer. Then, the conductor bumps are pressed against the insulating film with a given pressing force. By applying a voltage (electric stress) between the conductor bumps and the conductor layer, the characteristics including I-V characteristic, gate leakage current, and TDDB or the dimensions including thickness are evaluated.
Claims18
method for evaluating an insulating film provided on a conductor layer in a semiconductor substrate for characteristics or dimensions thereof, the method comprising the steps of:
- (a) disposing a measuring member having conductor bump and wire connected to the conductor bump above the substrate, while placing the conductor bump and the insulating film in opposing relation;
- (b) bringing the conductor bumps into contact with the insulating film and providing a MIS structure in which the gate insulating film is sandwiched between the conductor bump and the semiconductor substrate;
- and
- (c) applying an electric stress between the conductor bumps and the conductor layer and thereby evaluating the insulating film for the characteristics or dimensions thereof.
Dependencies are inferred from the claim text.