Apparatus and method for laser beam machining, and method for manufacturing semiconductor devices using laser beam machining

A laser beam machining method comprising:

• supplying a liquid, through which a laser beam can be transmitted, to a target surface of an object to be processed from an inlet port located so as to substantially align with the target surface;
• flowing the liquid through the target surface to an outlet port located so an to substantially align with the target surface;
• guiding a laser beam to the target surface through the liquid;
• and
• processing the target surface by the laser beam, wherein the liquid is supplied to the target surface in a constant direction in a substantially uniform flow.

A laser beam machining method comprising;

• supplying a liquid, through which a laser beam can transmitted, to a target surface of an object to be processed from an inlet port located so as to substantially align with the target surface;
• flowing the liquid through the target surface to an outlet port located so as to substantially align with the target surface;
• guiding a laser beam to the target surface through the liquid;
• and processing the target surface by the laser beam, wherein the object is a semiconductor wafer, and the target surface of the semiconductor wafer is machined by the laser beam to form a dicing groove in the semiconductor wafer.

A laser beam machining method comprising;

• supplying a liquid stream, through which a laser beam can be transmitted, to a target of a semiconductor wafer to be processed, in a parallel direction to a surface of the semiconductor wafer;
• guiding a laser beam to the target through the liquid;
• and
• processing the target by the laser beam, wherein the liquid is supplied to the target in a constant direction in a substantially uniform flow.

A laser beam machining method comprising:

• supplying a liquid stream, through which a laser beam can be transmitted, to a target of a semiconductor wafer to be processed, in a parallel direction to a surface of the semiconductor wafer;
• guiding a laser beam to the target through the liquid;
• and
• processing the target by the laser beam, wherein the target is a film fanned on the surface of the semiconductor wafer.

A laser beam machining method comprising:

• supplying a liquid stream, through which a laser beam can be transmitted, to a target of a semiconductor wafer to be processed, in a parallel direction to a surface of the semiconductor wafer;
• guiding a laser beam to the target through the liquid;
• and
• processing the target by the laser beam, wherein the target is a resist film formed on the surface of the semiconductor wafer via an antireflection film and a predetermined area of the resist film and the antireflection film is removed by scanning the laser beam.