Method of deep contact fill and planarization for dual damascene structures

A method of manufacturing a dual damascene device, comprising:

• forming a plurality of active devices in a substrate;
• providing a layer of dielectric material over the active devices and the substrate;
• providing a plurality of vertical openings in the layer of dielectric material, wherein at least one of the plurality of vertical openings extends through to one of the plurality of active devices;
• depositing a first photoresist layer over the layer of dielectric material, the first photoresist layer filling the plurality of vertical openings;
• etching the first photoresist layer such that the first photoresist layer has a first substantially uniform thickness over the dielectric layer;
• and
• depositing an anti-reflection coating layer over the first photoresist layer.

A method of manufacturing a dual damascene device, comprising:

• forming a plurality of active devices in a substrate;
• providing a layer of dielectric material over the active devices and the substrate;
• providing a plurality of vertical openings in the layer of dielectric material, wherein at least one of the plurality of vertical openings extends through to one of the plurality of active devices;
• depositing a first photoresist layer over the layer of dielectric material, the first photoresist layer filling the plurality of vertical openings;
• etching the first photoresist layer such that the first photoresist layer has a first substantially uniform thickness over the dielectric layer;
• depositing an anti-reflection coating layer over the first photoresist layer;
• providing a second photoresist layer over the anti-reflection coating layer;
• patterning and defining the second photoresist layer;
• etching the anti-reflection coating layer and the first photoresist layer to form a plurality of trenches in the layer of dielectric material;
• removing the first photoresist layer, the anti-reflection coating layer and the second photoresist layer;
• and
• providing metal to the plurality of vertical openings and plurality of trenches.