Process flow and pellicle type for 157 nm mask making
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSan-De Tzu, Anthony Yen, Chung Hsing Chang, Chen-Hao Hsieh
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSan-De Tzu, Anthony Yen, Chung Hsing Chang, Chen-Hao Hsieh
Estimating the term…
A method for forming a photomask and pellicle suitable for use in photolithography with incident electromagnetic radiation in a wavelength range from above 250 nm to below 150 nm. The opaque regions of the photomask are formed directly within a transparent F-doped quartz layer by either gallium ion staining using a focused ion beam (FIB) or by deposition of carbon atoms within trenches formed in the transparent layer, said carbon atom deposition being a result of the interaction of a FIB with styrene molecules. An alignment boundary formed on the resulting mask allows a hard pellicle to be fit directly over it so as to avoid warping.
A method for forming a photolithographic mask and pellicle comprising:
A method for fabricating a photomask and pellicle comprising:
A photomask to be used in photolithography for transferring a mask pattern by means of incident electromagnetic radiation within a preselected range of wavelengths comprising:
A photomask and pellicle to be used in photolithography for transferring a mask pattern by means of incident electromagnetic radiation within a preselected range of wavelengths comprising:
Dependencies are inferred from the claim text.