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US 6,719,920 B2Granted
Slurry for polishing a barrier layer
AssigneeIntel Corporation
InventorAnne E. Miller
Life of this patent
Estimating the term…
Abstract
A slurry is described that comprises a mixture of between about 0.01 mole and about 0.1 mole per liter of an organic acid salt, between about 1% to about 20% by volume of an abrasive, and an oxidizer.
Claims2
A slurry for polishing a barrier layer that serves to isolate a copper layer from a dielectric layer comprising a mixture of:
- about 14.7 grams per liter of a citric acid salt;
- between about 4.4% and about 8.8% by volume of a silica based abrasive;
- and
- about 0.38 grams per liter of a 30% H2O2 solution.
1 more element
Dependencies are inferred from the claim text.