Apparatus for epoxy loc die attachment
AssigneeMicron Technology, Inc.
InventorEd A. Schrock
Life of this patent
Estimating the term…
Abstract
A plurality of lead frames is supplied in a lead frame-by-frame sequence. A curable adhesive, preferably a 505 Epoxy, is applied to one surface of each lead frame as it indexes through an application device. An attaching device attaches a semiconductor device to each lead frame with the adhesive by holding the semiconductor device in place to cure for a preselected period of time of about one second. Later, the lead frames have their edges trimmed and then are separated into separate lead frames.
Claims11
A system for attaching a semiconductor device to at least one lead frame of a plurality of lead frames to form a semiconductor device assembly, said system comprising:
- a source of curable adhesive;
- a source of a plurality of lead frames, each lead frame of said plurality of lead frames having an attaching surface;
- an application apparatus connected to said source of curable adhesive receiving curable adhesive therefrom and connected to said source of said plurality of lead frames, said application apparatus for applying an amount of said curable adhesive to a portion of said attaching surface of said each lead frame of said plurality of lead frames, said application apparatus including at least one of a roller positioned to have portions thereof selectively contact portions of said attaching surface of a lead frame of said source of said plurality of lead frames and a printing structure positioned to have portions thereof selectively contact portions of said attaching surface of a lead frame of said source of said plurality of lead frames;
- a source of semiconductor devices;
- and
- an attaching apparatus connected to said source of semiconductor devices obtaining a semiconductor device from said source of semiconductor devices, said attaching apparatus attaching each semiconductor device of said source of semiconductor devices to a lead frame of said plurality of lead frames by urging each said semiconductor device into contact with said curable adhesive applied to said portion of said attaching surface of each said lead frame of said plurality of lead frames and holding each of said semiconductor devices in contact with said curable adhesive for a preselected period of time, said attaching apparatus including press apparatus for pressing a semiconductor device of said source of semiconductor devices into contact with said curable adhesive and transfer apparatus for transferring a semiconductor device of said source of semiconductor devices to said press apparatus.
Dependencies are inferred from the claim text.