Cooling apparatus boiling and condensing refrigerant with improved tunnel structure
AssigneeDenso Corporation
InventorsHajime Sugito, Hiroyuki Osakabe, Shinichi Morihira, Yuhei Kunikata
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AssigneeDenso Corporation
InventorsHajime Sugito, Hiroyuki Osakabe, Shinichi Morihira, Yuhei Kunikata
Estimating the term…
A first intermediate plate 5C adjacent to a heat receiving plate 5A and a second intermediate plate 5D adjacent to the first intermediate plate 5C are provided so that the slit width of the openings (first opening 5a) in the first intermediate plate 5C is wider than that (second opening 5b) in the second intermediate plate 5D. In this way, when the first intermediate plate 5C and the second intermediate 5D are stacked, a tunnel structure is formed in which the opening dimension L3 (the opening dimension of the second openings 5b) of the communicating sections through which the first openings 5a and the second openings 5b communicate with each other is smaller than the length L2 (the opening dimension of the first openings 5a) of the tunnel portions (L2>L3). Therefore, a heat-generating member with large density of heat generation can be effectively cooled.
A cooling apparatus boiling and condensing refrigerant:
A cooling apparatus boiling and condensing refrigerant:
Dependencies are inferred from the claim text.