Three dimensional reconstruction metrology
AssigneeAgere Systems Inc.
InventorsErik Cho Houge, John Martin McIntosh, Larry E. Plew
Life of this patent
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AssigneeAgere Systems Inc.
InventorsErik Cho Houge, John Martin McIntosh, Larry E. Plew
Estimating the term…
A system and method of metrology (10) whereby a three dimensional shape profile is defined (16) for a surface feature on a substrate by applying (38) a transform function F(x) to an image intensity map I(x,y) obtained (40) by inspecting the substrate with a scanning electron microscope (12). The transform function F(x) is developed (34) by correlating the image intensity map of a first wafer (18) to a height vector (32) obtained by inspecting the first wafer with a more accurate metrology tool, for example a stylus nanoprofilometer (14). A simple ratio-based transform may be used to develop F(x). An asymmetric multiple parameter characterization of the three dimensional shape profile may be developed (74) by plotting critical space and width dimensions (SL, SR, W1, WR) from a vertical axis (C—C) as a function of height of the feature.
A method of characterizing a feature positioned along a plane comprising:
A method of characterizing comprising:
A method of characterizing a feature positioned along a plane comprising:
A method of characterizing comprising:
A method comprising:
An apparatus for characterizing a surface of a specimen, the apparatus comprising:
A system for characterizing a surface of a specimen, the system comprising:
Dependencies are inferred from the claim text.