Mechanisms and techniques for fastening a heat sink to a circuit board component

A circuit board assembly comprising:

• a circuit board including a section of circuit board material and a circuit board component mounted to the section of circuit board material;
• a heat sink apparatus that connects to the circuit board, the heat sink apparatus including:
• a heat sink having a plurality of circuit board component contact portions and a plurality of fin portions extending from the contact portions, the circuit board component contact portions of the heat sink conforming to a surface of the circuit board component when coupled to the circuit board component;
• a retainer in communication with the circuit board component contact portions of the heat sink, the retainer causing the circuit hoard component contact portions of the heat sink to conform to the surface of the circuit board component;
• and
• at least two retainer clips coupled to the circuit board, the retainer engageable with the retainer clips to secure the heat sink to the circuit board component.

A method for assembling a circuit board assembly comprising the steps of:

• placing a heat sink having a plurality of circuit board component contact portions and a plurality of fin portions extending from the circuit board component contact portions in communication with a circuit board component, the circuit board component contact portions of the heat sink conforming to a surface of the circuit board component when coupled to the circuit board;
• placing a retainer in communication with the circuit board contact portions of the heat sink, the retainer causing the circuit board component contact portions of the heat sink to conform to the surface of the circuit board component;
• and
• securing the retainer to at least two retainer clips coupled to the circuit board to secure the heat sink to the circuit board component.

A heat sink apparatus for cooling a circuit board component mounted to a circuit board, the heat sink apparatus comprising:

• a heat sink having a folded fin structure, the folded fin structure having a plurality of circuit board component contact portions and a plurality of fin portions extending from the circuit board component contact portions, each fin portion having a first fin wall, a second fin wall, and a connection portion coupling the first fin wall and the second fin wall, the circuit board component contact portions of the heat sink conforming to a surface of the circuit board component when coupled to the circuit board component;
• a double buckling beam retainer in communication with the circuit board component contact portions of the heat sink, the double buckling beam retainer causing the circuit board component contact portions of the heat sink to conform to the surface of the circuit board component;
• and
• at least two surface mount clips coupled to a first surface of the circuit board, the retainer engageable with the surface mount clips to secure the heat sink to the circuit board component.

A circuit board assembly comprising:

• a circuit board including a section of circuit board material and a circuit board component mounted to the section of circuit board material;
• a heat sink apparatus that connects to the circuit board, the heat sink apparatus including:
• a heat sink having a folded fin structure, the folded fin structure having a plurality of circuit board component contact portions and a plurality of fin portions extending from the circuit board component contact portions, each fin portion having a first fin wall, a second fin wall, and a connection portion coupling the first fin wall and the second fin wall, the circuit board component contact portions of the heat sink conforming to a surface of the circuit board component when coupled to the circuit board component;
• a double buckling beam retainer in communication with the circuit board component contact portions of the heat sink, the double buckling beam retainer causing the circuit board component contact portions of the heat sink to conform to the surface of the circuit board component;
• and
• at least two surface mount clips coupled to a first surface of the circuit board, the retainer engageable with the surface mount clips to secure the heat sink to the circuit board component.

A heat sink apparatus for cooling a circuit board component mounted to a circuit board, the heat sink apparatus comprising:

• a heat sink having a folded fin structure, the folded fin structure having a plurality of circuit board component contact portions and a plurality of fin portions extending from the circuit board component contact portions, each fin portion having a first fin wall, a second fin wall, and a connection portion coupling the first fin wall and the second fin wall, the circuit board component contact portions of the heat sink conforming to a surface of the circuit board component when coupled to the circuit board component;
• a double buckling beam retainer in communication with the circuit board component contact portions of the heat sink, the double buckling beam retainer causing the circuit board component contact portions of the heat sink to conform to the surface of the circuit board component;
• and
• at least two horseshoe clips coupled to the circuit board using a plurality fasteners, the circuit board defining a plurality of openings for the fasteners, each opening having a diameter between 0.00160 inches and 0.0500 inches, the retainer engageable with the surface mount clips to secure the heat sink to the circuit board component.

A circuit board assembly comprising:

• a circuit board including a section of circuit board material and a circuit board component mounted to the section of circuit board material;
• a heat sink apparatus that connects to the circuit board, the heat sink apparatus including:
• a heat sink having a folded fin structure, the folded fin structure having a plurality of circuit board component contact portions and a plurality of fin portions extending from the circuit board component contact portions, each fin portion having a first fin wall, a second fin wall, and a connection portion coupling the first fin wall and the second fin wall, the circuit board component contact portions of the heat sink conforming to a surface of the circuit board component when coupled to the circuit board component;
• a double buckling beam retainer in communication with the circuit board component contact portions of the heat sink, the double buckling beam retainer causing the circuit board component contact portions of the heat sink to conform to the surface of the circuit board component;
• and
• at least two horseshoe clips coupled to the circuit board using a plurality fasteners, the circuit board defining a plurality of openings for the fasteners, each opening having a diameter between 0.00160 inches and 0.0500 inches, the retainer engageable with the surface mount clips to secure the heat sink to the circuit board component.