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US 6,713,882 B2Granted
Resin sealing apparatus and resin sealing method
AssigneeRenesas Technology Corp.
InventorNaoya Yasuda
Life of this patent
Estimating the term…
Abstract
The resin sealing apparatus includes a mold that has a main cavity into which a portion of a semiconductor device to be sealed with a resin is disposed. Furthermore, an external-shape regulating member is detachably accommodated in the main cavity of the mold to form a new cavity inside the main cavity.
Claims4
A resin sealing apparatus comprising:
- a mold having a main cavity in which a portion of a semiconductor device to be sealed with a resin is disposed;
- and
- an external-shape regulating member detachably accommodated in the main cavity of the mold, for forming a new cavity within the main cavity, wherein
- the mold has inner-wall surfaces which defines a shape of the main cavity, the inner-wall surfaces including a first surface onto which the external-shape regulating member is placed, and a second surface adjacent to the first surface having an angle of more than 90 degrees relative to the first surface, and
- the external-shape regulating member has a third surface facing the first surface and fourth surface facing the second surface, the fourth surface having an angle of more than 90 degrees relative to the third surface, the angle of the fourth surface being substantially the same as that of the second surface relative to the first surface.
2 more elements
Dependencies are inferred from the claim text.