Packaging structure integrating passive devices
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsSheng-Tsung Liu, Kang-Wei Ma
Life of this patent
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Abstract
In a leadframe packaging structure, a leadframe includes a plurality of first leads, a plurality of second leads, and a die pad. The first leads define a chip-bonding region in which is arranged the die pad. The second leads extend and terminate into a plurality of contact pads in the chip-bonding region. An adhesive tape further is bonded on bottom surfaces of the contact pads. A chip is bonded on the die pad. At least a passive device is mounted between and electrically connects the contact pads. A plurality of bonding wires respectively connect the chip, the passive device, and the first and second leads. An encapsulant material encapsulates the chip, the passive device, and the bonding wires.
Claims15
A packaging structure integrating passive devices, comprising:
- a leadframe, wherein the leadframe includes a plurality of first leads defining a chip-bonding region, a plurality of second leads extending and terminating in a plurality of contact pads within the chip-bonding region, and a die pad located at a sideways biased position in the chip-bonding region;
- a chip bonded onto the die pad;
- at least a passive device mounted between and connected to the contact pads;
- a plurality of bonding wires electrically connecting the chip, the passive device, and the first and second leads to one another;
- and
- an encapsulant material encapsulating the chip, the passive device, and the bonding wires.
A leadframe structure suitable for use in a chip packaging structure, the leadframe structure comprising:
- a plurality of first leads defining a chip-bonding region in the leadframe structure;
- a plurality of second leads extending and terminating in a plurality of contact pads within the chip-bonding region;
- and
- a die pad arranged at a sideways biased position in the chip-bonding region.
A packaging structure integrating passive devices, comprising:
- a leadframe, wherein the leadframe includes a plurality of first leads defining a chip-bonding region, a plurality of second leads extending and terminating in a plurality of contact pads within the chip-bonding region, and a die pad located at a sideways biased position in the chip-bonding region;
- an adhesive tape bonded to bottom surfaces of the contact pads;
- a chip bonded onto the die pad;
- at least a passive device mounted between and connected to the contact pads;
- a plurality of bonding wires electrically connecting the chip, the passive device, and the leads to one another;
- and
- an encapsulant material encapsulating the chip, the passive device, and the bonding wires.
A leadframe structure suitable for use in a chip packaging structure, the leadframe structure comprising:
- a plurality of first leads defining a chip-bonding region in the leadframe structure;
- a plurality of second leads extending and terminating in a plurality of contact pads within the chip-bonding region;
- an adhesive tape bonded to bottom surfaces of the contact pads;
- and
- a die pad arranged at a sideways biased position in the chip-bonding region.
Dependencies are inferred from the claim text.