Semiconductor manufacturing using modular substrates

A method for forming a semiconductor device, comprising the steps of:

• (a) simultaneously processing a first plurality of semiconductor devices through a first processing operation, said first plurality of semiconductor devices being formed on a first plurality of discrete semiconductor units fixedly arranged along a plane, each semiconductor unit including at least one of said semiconductor devices being formed thereon;
• testing at least one of said semiconductor devices;
• (c) replacing each defective semiconductor unit with a further semiconductor unit which includes at least one semiconductor device formed thereon, to form a second plurality of semiconductor devices which are formed on a second plurality of discrete semiconductor units;
• and
• (d) simultaneously processing said second plurality of semiconductor devices through a second processing operation, said second plurality of discrete semiconductor units being fixedly arranged along a plane.

A method for forming a semiconductor device, comprising the steps of;

• (a) providing a plurality of modular processing units, each adapted for having at least one semiconductor device formed on a semiconductor surface thereof, and adapted for being individually processed through semiconductor processing equipment;
• (b) configuring a first cohesive processing unit including a first group of modular processing units of said plurality of modular processing units arranged along a fixed, two-dimensional array, to be processed simultaneously through a first processing operation;
• (c) processing said first cohesive processing unit through said first processing operation;
• and
• (d) processing each of said modular processing units through a second processing operation individually.