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US 6,712,909 B2Granted
Substrate processing apparatus and method for manufacturing semiconductor device
AssigneeHitachi Kokusai Electric Inc.
InventorKouji Tometsuka
Life of this patent
Estimating the term…
Abstract
A substrate processing apparatus and a method for manufacturing a semiconductor device can resolve the problems that semiconductor film by-products are incorporated into a boat rotation mechanism so as to allow the mechanism portion to be locked, whereby a high quality semiconductor film can be generated with stability for a long period of time.
Claims4
A substrate processing apparatus comprising:
- a reaction chamber with an opening which defines a processing space;
- a heater which heats a substrate;
- a substrate supporting member which supports the substrate in said reaction chamber;
- a cover body, made of metal, which covers the opening of said reaction chamber via a seal member;
- a rotation mechanism which rotates said substrate supporting member supported by a rotation shaft;
- a flow passage, provided in said cover body, which cools said seal member;
- and
- an extending member which extends from said substrate supporting member;
- wherein the extending member includes:
- a drooping portion which extends in a direction from the substrate supporting member toward the cover body;
- and
- an extending portion which extends radially outwardly from a lower end of the drooping portion toward a reaction chamber wall and extends along a surface of the cover body exposed to the processing space.
9 more elements
A substrate processing apparatus comprising:
- a reaction chamber with an opening which defines a processing space;
- a heater which heats a substrate;
- a substrate supporting member which supports the substrate in said reaction chamber;
- a cover body, made of metal, which covers the opening of said reaction chamber via a seal member;
- a flow passage, provided in said cover body, which cools said seal member;
- and
- an extending member which extends from said substrate supporting member and extends along a proximity of a surface of the cover body exposed to the processing space;
- wherein said cover body is warmed with heat which transfers from said substrate supporting member to said extending member.
5 more elements
Dependencies are inferred from the claim text.