CPU cooling structure
AssigneeGlobal WIN Technology Co., Ltd.
InventorShih-Jen Lin
Life of this patent
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Abstract
A CPU cooling structure is constructed to include a heat sink adapted for mounting on a motherboard to absorb heat from a CPU of the motherboard, a fan provided above the heat sink and adapted for causing currents of air toward the heat sink to carry heat away from the heat sink, and a flow guide mounted on the heat sink to hold the fan above the heat sink, the flow guide having two flow guide holes and an air damper suspended in between the flow guide holes and adapted for guiding air from the fan toward the center area of the heat sink for enabling air to flow through air passages in the heat sink in reversed directions to carry heat away from the heat sink.
Claims9
A CPU cooling structure comprising a heat sink adapted for mounting on a motherboard to absorb heat from a CPU of the motherboard, and a fan provided above said heat sink and adapted for causing currents of air toward said heat sink to carry heat away from said heat sink, wherein a flow guide is mounted on said heat sink to support said fan above said heat sink, said flow guide comprising two flow guide holes, and at least one air damper suspended in between said flow guide holes and adapted for guiding air from said fan toward the center area of said heat sink for enabling air to flow through air passages in said heat sink in reversed directions to carry heat away from said heat sink.
Dependencies are inferred from the claim text.