Integrated circuit having a reduced spacing between a bus and adjacent circuitry
AssigneeVirtual Silicon Technology, Inc.
InventorsBillie Jean Rivera, William Gordon Walker
Life of this patent
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Abstract
An integrated circuit that reduces spacing between circuitry and a bus. In accordance with this invention, the bus is a strip of conductive material in a layer of the integrated circuit. The layer includes at least one slot that removes conductive material from the bus. The removal of the conductive material in the slot allows the space between circuitry adjacent the bus and the bus to be reduced.
Claims33
An integrated circuit that minimizes spacing between circuitry comprising:
- a first circuit in a first layer of said integrated circuit;
- and
- a bus in said first layer of said integrated circuit adjacent said first circuit wherein said bus includes a strip of conductive material with at least one slot defined in said strip of conductive material to remove conductive material from said strip to allow a reduction of spacing between said bus and said first circuit wherein spacing between said bus and an adjacent circuit is determined based upon an amount of said conductive material in said strip of conductive material of said bus.
The integrated circuit of 7 wherein said strip of conductive material comprises:
- a third strip of conductive material in said first layer that is adjacent to and substantially parallel to said first strip on an opposite side of said first strip of power material from said second strip wherein said third strip is spaced apart from said first strip;
- a second plurality of cross connect strips of conductive material the connect said third strip to said first strip wherein a second plurality of slots are defined as spaces between adjacent ones of said second plurality of connect strips.
A method for providing a design of an integrated circuit that provides minimal spacing between a bus that transmits signal and a circuitry adjacent to said bus, said method comprising:
- placing a bus in a first layer of an integrated circuit;
- defining at least one slot in said bus to remove excess conductive material from said bus to reduce spacing required between said bus and an adjacent circuit;
- determining an amount of spacing between said bus and said first circuit based upon an amount of conductive material in said bus;
- and
- placing a first circuit in said first layer adjacent to said bus on a first side of said bus wherein said spacing between said bus and said first circuit is reduced in response to removing excess conductive material from said bus with said slot in said bus.
The method of 24 said step of placing said bus further comprises:
- placing a third strip of conductive material in said first layer adjacent and substantially parallel to said first strip on an opposite side of said first strip of power material from said second strip wherein said third strip is spaced apart from said first strip;
- and
- connecting said third strip to said first strip with a second plurality of cross connect strips of conductive material wherein a second plurality of slots are defined as spaces between adjacent ones of said second plurality of connect strips.
Dependencies are inferred from the claim text.