Inspection system, inspection apparatus, inspection program, and production method of semiconductor devices

An inspection system, comprising:

• an inspection means that detects the positions and size of particles or pattern defects with which an inspected object is provided;
• a storage means that is connected to the inspection means via a network and stores inspection data that the inspection means detected and obtained and kill ratio computation data for the position and size of the particles or pattern defects in a device that is formed in the inspected object;
• a computation means that computes kill ratios of individual particles or pattern defects based on the inspection data and the kill ratio computation data and kill ratios for every device that comprises the inspected object from the kill ratio of every individual particle or pattern defect;
• and
• an output means that outputs kill ratios for every individual device that comprises an inspected object as in wafer-shaped two-dimensional map information.

An inspection apparatus, comprising:

• an inspection means that detects the positions and size of particles or pattern defects with which an inspected object is provided:
• a storage means that is connected to the inspection means via a network and stores inspection data that the inspection means detected and obtained and kill ratio computation data for the positions and size of the particles or pattern defects in a device that is formed in the inspected object, wherein the storage means further stores the decision result of a good product and a bad product in a probing test of an inspected object and the inspection data detected by the inspection means and the kill ratio computation data are created from the decision result of the good and bad products in the probing test;
• and
• a computation means that computes kill ratios of individual particles or pattern defects based on the inspection data and the kill ratio computation data and kill ratios for every device that comprises the inspected object from the kill ratio of every individual particle or pattern defect.

An inspection apparatus, comprising:

• an inspection means that detects the positions and size of particles or pattern defects with which an inspected object is provided;
• a storage means that is connected to the inspection means via a network and stores inspection data that the inspection means detected and obtained and kill ratio computation data for the positions and size of the particles or pattern defects in a device that is formed in the inspected object;
• a computation means that computes kill ratios of individual particles or pattern defects based on the inspection data and the kill ratio computation data and kill ratios for every device that comprises the inspected object from the kill ratio of every individual particle or pattern defect;
• and
• an output means that outputs kill ratios for every individual device that comprises an inspected object as in wafer-shaped two-dimensional map information.

An inspection system, comprising:

• a defect inspection tool for detecting positions and sizes of particles or pattern defects in an inspected object;
• a probe tester for testing devices in the inspected object;
• data storage for storing inspection data from the defect inspection tool and kill ratio computation data for the position and size of the particles or pattern defects in each device in the inspected object,
• wherein the data storage is further for storing a decision result of good products and bad products in a device test by the probe tester of an inspected object, and the inspection data from the defect inspection tool and the kill ratio computation data are created from the decision result of the good and bad products in the device test by the probe tester;
• and
• a processing unit for computing kill ratios of individual particles or pattern defects based on the inspection data and the kill ratio computation data, of every device that comprises the inspected object.

An inspection system, comprising:

• a defect inspection tool for detecting positions and sizes of particles or pattern defects in an inspected object;
• a probe tester for testing devices in the inspected object;
• data storage for storing inspection data from the defect inspection tool and kill ratio computation data for the position and size of the particles or pattern defects in each device in the inspected object;
• a processing unit for computing kill ratios of individual particles or pattern defects, based on the inspection data and the kill ratio computation data, of every device that comprises the inspected object from the kill ratio;
• and
• an output screen for outputting kill ratios for every individual device that comprises an inspected object, as wafer-shaped two-dimensional map information.