Cooling plate arrangement for electronic components
AssigneeHewlett-Packard Development Company, L.P.
InventorsChandrakant D. Patel, Hannsjörg Obermaier, Vernon Alan Barber
Life of this patent
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Abstract
An apparatus for cooling electronic components contained within a housing member is configured to be easily removed from the housing member. In one example embodiment, an apparatus for cooling an electronic component is coupled to a housing that contains an electronic component. The apparatus includes a heat conductive member having a first lateral edge shaped to slidably attach and retain the heat conductive member to a portion of the housing. A top surface of the housing includes a second edge shaped to slidably receive and retain the heat conductive member.
Claims28
A cooling arrangement for an electronic component disposed on a circuit board, the cooling arrangement comprising:
- a housing having a first portion, and a second portion opposite the first portion and in thermal contact with and configured to cover the electronic component;
- a heat conductive member having a first surface shaped to slidably attach the heat conductive member to the housing via the first portion of the housing;
- and
- a retention member that retains contact between the first surface of the heat conductive member and the first portion of the housing.
A cooling arrangement for one or more electronic components disposed on a substrate, the cooling arrangement comprising:
- a first heat-conductive member having first and second surfaces, wherein the second surface is in thermal contact with and shaped to cover at least one of the electronic components;
- and
- a second heat-conductive member shaped to slidably attach to the first surface of the first heat-conductive member wherein the surface of the first member and a portion of the second member have complementary shapes for slidable attachment, the second member has opposing c-shaped side portions, and the first member has opposing protrusions shaped to slide into the c-shaped side portions of the second member;
- a pair of retention members disposed between the first and second members within the c-shaped side portions of the first member.
An electronic package, comprising:
- a substrate;
- a plurality of electronic components mounted on the substrate;
- a first heat-conductive member having first and second surfaces, wherein the second surface is in thermal contact with and shaped to cover at least one of the electronic components;
- and
- a second heat-conductive member shaped to slidably attach to the first surface of the first heat-conductive member, wherein the first surface of the first member and a portion of the second member have complementary shapes for slidable attachment, the second member has opposing c-shaped side portions, and the first member has opposing protrusions shaped to fit slide into the c-shaped side portions of the second member;
- a pair of retention members disposed between the first and second members within the c-shaped side portions of the first member.
A cooling arrangement for an electronic component disposed on a circuit hoard, the cooling arrangement comprising:
- a housing having a first portion, and a second portion opposite the first portion and in thermal contact with and configured to cover the electronic component;
- a heat conductive member having a first surface shaped to slidably attach the heat conductive member to the housing via the first portion of the housing, wherein the first surface of the heat conductive member and the first portion of the housing have mated dovetail shapes.
A cooling arrangement for one or more electronic components disposed on a substrate, the coding arrangement comprising:
- a first heat-conductive member having first and second surfaces, wherein the second surface is in thermal contact with and shaped to cover at least one of the electronic components;
- and
- a second heat-conductive member shaped to slidably attach to the first surface of the first beat-conductive member, wherein the first surface of the first member and a portion of the second member have mated dovetail shapes for slidable attachment.
An electronic package, comprising:
- a substrate;
- a plurality of electronic components mounted on the substrate;
- a first heat-conductive member having first and second surfaces, wherein the second surface is in thermal contact with and shaped to cover at least one of the electronic components;
- and
- a second heat-conductive member shaped to slidably attach to the first surface of the first heat-conductive member, wherein the first surface of the first member and a portion of the second member have mated dovetail shapes for slidable attachment.
Dependencies are inferred from the claim text.