Apparatus for cooling electronic components in a phase change electronic cooling system

A phase change cooling system for cooling automotive electronic components, comprising:

• a sealed container;
• a nonconductive liquid partially filling said container, the electronic components disposed therein, the components being immersed in the liquid when said container is in a predetermined orientation relative to the ground,
• a hood disposed in the container adjacent the electronic components immersed in a nonconductive liquid partially filling the container to a liquid level;
• and
• at least one cooling tube having one end connected to said hood and an opposite end disposed adjacent a portion of the electronic components whereby during operation the electronic components transfer heat to the liquid, causing a first portion of the liquid below said hood to vaporize forming bubbles, the bubbles travelling through said at least one tube and carrying an entrained second portion of the liquid to said opposite end, and when the container is oriented to expose the portion of the electronic components above the liquid level, the bubbles and the entrained liquid exit said opposite end of said at least one tube onto the exposed portion of the electronic components to cool the exposed portion of the electronic components.

A phase change cooling system for cooling an automotive electronic system, comprising:

• a sealed container;
• a plurality of electronic components, said components being a part of the electronic system and disposed in said container;
• a plurality of high heat generating electronics, said high heat generating electronics being a part of the electronic system and disposed in said container;
• a nonconductive liquid partially filling said container to a liquid level, said components and said high heat generating electronics being immersed in said liquid when said container is in a predetermined orientation relative to the ground,
• a hood disposed in said container adjacent said high heat generating electronics immersed in said nonconductive liquid below said liquid level;
• and
• at least one cooling tube having one end connected to said hood and an opposite end disposed adjacent a portion of said electronic components whereby during operation said electronic components and said high heat generating electronics transfer heat to said liquid, causing a first portion of said liquid below said hood to vaporize forming bubbles, the bubbles traveling through said at least one tube and carrying an entrained second portion of the liquid to said opposite end, and when the container is oriented to expose the portion of said electronic components above said liquid level, the bubbles and said entrained liquid exit said opposite end of said at least one tube onto said exposed portion of said electronic components to cool said exposed portion of said electronic components.