Multiple compressor refrigeration heat sink module for cooling electronic components

A computer system sub-system, said computer system sub-system comprising:

• at least one electronic component;
• and
• a multiple compressor refrigeration heat sink module for cooling said electronic component, said multiple compressor refrigeration heat sink module comprising:
• a multiple compressor refrigeration heat sink module housing;
• refrigerant;
• at least two compressors;
• a condenser;
• an expansion device;
• and
• at least one evaporator;
• wherein,
• said at least two compressors, said condenser, said expansion device and said at least one evaporator are coupled together in a refrigeration loop within said multiple compressor refrigeration heat sink module housing and said refrigerant is contained within said refrigeration loop such that said multiple compressor refrigeration heat sink module is a self-contained module;
• further wherein,
• said multiple compressor refrigeration heat sink module is mounted directly over a first surface of said electronic component.

An electronic system, said electronic system comprising:

• at least one electronic component;
• and
• a multiple compressor refrigeration heat sink module for cooling said electronic component, said multiple compressor refrigeration heat sink module comprising:
• a multiple compressor refrigeration heat sink module housing;
• refrigerant;
• at least two compressors;
• a condenser;
• an expansion device;
• and
• at least one evaporator;
• wherein,
• said at least two compressors, said condenser, said expansion device and said at least one evaporator are coupled together in a refrigeration loop within said multiple compressor refrigeration heat sink module housing and said refrigerant is contained within said refrigeration loop such that said multiple compressor refrigeration heat sink module is a self-contained module.