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US 6,686,642 B2Granted
Multi-level integrated circuit for wide-gap substrate bonding
AssigneeHewlett-Packard Development Company, L.P.
InventorsMichael J. Regan, John Liebeskind, Charles C. Haluzak
Life of this patent
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Abstract
An integrated circuit includes a substrate having an etched surface and a non-etched surface. The etched surface contains circuit elements and the non-etched surface contains a bonding surface. The non-etched surface is located at a predetermined height from the etched surface. Bonding this integrated circuit with another substrate creates a wide-gap between the substrates that is preferably evacuated and hermetically sealed.
Claims17
A micro-machined system, comprising:
- a first substrate having a first surface containing circuit elements of at least one of logic circuitry or electron emitter array and a second surface elevated from the first surface through a gradual incline, the substrate including a set of continuous conductive traces extending from the first surface to the second surface;
- and
- a second substrate having a set of conductive traces, the second substrate bonded to said first substrate such that the set of conductive traces of the first substrate contacts the set of conductive traces of the second substrate to form electrical connections.
Dependencies are inferred from the claim text.