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US 6,686,615 B1Granted
Flip-chip type semiconductor device for reducing signal skew
AssigneesChipMOS Technologies (Bermuda) Ltd., ChipMOS Technologies Inc.
InventorsS. J. Cheng, An-Hong Liu, Yeong-Her Wang, Yuan-Ping Tseng, Y. J. Lee
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Abstract
A flip chip type semiconductor device for reducing signal skew includes: a chip with bonding pads, and a plurality of bumping pads on the chip. Between each bonding pad and corresponding bumping pads is connected with a metal redistribution trace covered by a passivation layer. Each metal trace has an equal trace length for reducing signal skew.
Claims5
A flip chip type semiconductor device comprising:
- a chip having a surface formed with integrated circuits and a plurality of bonding pads;
- a plurality of bumping pads arranged on the surface of the chip;
- a plurality of redistribution traces arranged on the surface of the chip and connecting the bonding pads to the corresponding bumping pads, wherein at least one of the redistribution traces has a winding route so that all of the redistribution traces have equal lengths for reducing signal skew;
- a passivation layer formed on the surface of the chip to cover the redistribution traces and exposing at least partial surfaces of the bumping pads;
- and
- a plurality of bumps formed on the bumping pads and electrically connecting to the corresponding bumping pads.
3 more elements
Dependencies are inferred from the claim text.