Method of manufacturing chip type electronic parts including forming a photo-sensitive film on the chips and irradiating the end surfaces with light

A method of manufacturing a chip type electronic part comprising a chip substrate having at least a main surface and an end surface, the chip substrate having a terminal electrode thereon;

• the method comprising:
• forming a photo-sensitive film comprising a photo-active catalyst on a plurality of said chip substrates;
• arranging the plurality of said chip substrates relative to a light source such that the substrates are oriented in a single direction with the end surfaces of said chip substrates on which the terminal electrodes are to be identically oriented being irradiated by said light source;
• irradiating the end surfaces of said chip substrates with light from said light source so as to activate irradiated portions of said photo-sensitive film;
• precipitating a plating metal on said activated portions;
• and
• separating the plurality of said chip substrates.