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US 6,685,757 B2Granted
Polishing composition
AssigneeRodel Holdings, Inc.
InventorsHaofeng Xu, John Quanci
Life of this patent
Estimating the term…
Abstract
A polishing composition for polishing a semiconductor wafer includes comprises water, an abrasive that is preferably colloidal silica, water-soluble cellulose having a molecular weight of at least about 1,000,000 and an alkaline compound that is preferably ammonia. Tetra methyl ammonium hydroxide may also be added to the polishing composition.
Claims10
A polishing composition useful for polishing silicon wafers comprising by weight percent:
- 0.01 to 1 peanut shaped colloidal silica particles, the peanut shaped silica particles having a primary particle size of less than 50 nm;
- a water-soluble cellulose for providing a hydrophilic surface to the silicon wafers;
- 0.006 to 0.075 ammonia for increasing pH to at least 8 and increasing the silicon etch rate;
- and water.
1 more element
A polishing composition useful for polishing silicon wafers comprising by weight percent:
- 0.01 to 1 peanut shaped colloidal silica particles, the peanut shaped silica particles having a primary particle size of less than 50 nm;
- 0.006 to 1 water-soluble cellulose for providing a hydrophilic surface to the silicon wafers;
- 0.0003 to 0.05 weight percent tetra methyl ammonium hydroxide;
- 0.0125 to 0.0375 ammonia for increasing pH to at least 8 and increasing the silicon etch rate;
- and water.
2 more elements
Dependencies are inferred from the claim text.