Method and device for treating a substrate

#The present invention relates to a method and a device for treating the substrate of an integrated circuit or similar product during manufacture, the purpose of said treatment being at least to remove, using the action of at least one treatment liquid, unwanted particles borne by a face to be treated of said substrate.

#Such unwanted particles may include dust or similar particles, or even portions of unhardened photosensitive resin following exposure of the substrate through a mask. Consequently, said treatment liquid may be a washing or rinsing liquid (for example water) or even a liquid for curing said resin.

#Many methods and devices for such a treatment are already known. Among these known methods and devices, those described in document U.S. Pat. No. 4,655,162 propose holding said substrate, during said treatment, so that its surface to be treated is directed downward. This results in the advantage that said unwanted particles are easily removed, since they are subjected to the effects of gravity in addition to the dragging effect of said treatment liquid. In this earlier document, said treatment liquid is contained in a small dish, which is placed under said substrate, and into which the latter can be introduced.

#The figures of the appended drawing will give a proper understanding of how the invention can be produced. In these figures, identical references denote similar elements.

#FIG. 1 is a view in schematic elevation, partially in section, of an embodiment of the device according to the present invention.

#FIG. 2 illustrates schematically, using a partial view of FIG. 1 on a smaller scale, an embodiment of the device according to the present invention.

#The device for treating substrates of integrated circuits or of similar products, according to the present invention and shown schematically in FIG. 1, comprises a supporting frame 1 on which a work surface 2 directed upward is arranged. The working surface 2 rests on a tank 3, provided with an inlet 4 and an outlet 5 for a heat-conducting liquid and borne by the supporting frame 1. Pipes 6 pass through said tank 3 so that they are in thermal contact with the liquid flowing therein and they open upward via outlet orifices 6A at the level of said working surface 2. The pipes 6 are fed with treatment liquid for a substrate of integrated circuits in any known manner (not shown). In addition, the supporting frame 1 bears a tube 7 directed upward and fed with a rinsing liquid, for example water. Ultrasound transducers 8 are attached to one wall of the tank 3.

#Around the working surface 2, the supporting frame 1 comprises a peripheral channel 9, capable of collecting liquids, in order to carry them into a storage tank 10 placed under said working surface 2, by means of vertical pipes 11. The storage tank 10 comprises an outlet 12 for liquids and an outlet 13 for gasses, generated by said liquids.

#An annular deflector 14, capable of deflecting the spray of treatment liquid toward the channel 9, is mounted around the working surface 2 on the supporting frame 1. As indicated schematically by the double arrow 15, the annular deflector 14 can be moved vertically so that it can be moved closer to and away from the supporting frame 1. In FIG. 1, the low position of said deflector is shown in solid line and the high position 14H of said deflector 14 is shown in chain line.