Wire bond package with core ring formed over I/O cells
AssigneeLSI Logic Corporation
InventorRadoslav Ratchkov
Life of this patent
Estimating the term…
Abstract
A wire bond package for an integrated circuit die includes a first I/O core ring and a second I/O core ring formed in a first metal layer; a pad strap formed in a second metal layer overlapping the second I/O core ring; a via formed between the first metal layer and the second metal layer where the second I/O core ring and the pad strap overlap; a first core ring formed in a third metal layer overlapping the first I/O core ring; a via formed between the first metal layer and the third metal layer where the first I/O core ring and the first core ring overlap outside the power strap; a first power mesh formed in a fourth metal layer overlapping the first core ring; and a via formed between the third metal layer and the fourth metal layer where the first core ring and the first power mesh overlap.
Claims11
A wire bond package for an integrated circuit die comprising:
- a first I/O core ring and a second I/O core ring formed of a first metal layer of the wire bond package;
- a pad strap formed of a second metal layer of the wire bond package overlapping the second I/O core ring;
- a first via connecting the first metal layer and the second metal layer where the second I/O core ring and the pad strap overlap;
- a first core ring formed of a third metal layer of the wire bond package overlapping the first I/O core ring;
- a second via connecting the first metal layer and the third metal layer where the first I/O core ring and the first core ring overlap outside the power strap;
- a first power mesh formed of a fourth metal layer of the wire bond package overlapping the first core ring;
- and
- a third via connecting the third metal layer and the fourth metal layer where the first core ring and the first power mesh overlap.
A wire bond package for an integrated circuit die comprising:
- a first I/O core ring and a second I/O core ring formed of a first metal layer of the wire bond package wherein the first I/O core ring and the second I/O core ring overlap an I/O cell of the integrated circuit die;
- a pad strap formed of a second metal layer of the wire bond package wherein the pad strap overlaps the second I/O ring;
- a first via connecting the first metal layer and the second metal layer where the second I/O core ring and the pad strap overlap;
- a first core ring formed of a third metal layer of the wire bond package wherein the first core ring overlaps the first I/O core ring;
- a second via connecting the first metal layer and the third metal layer where the first I/O core ring and the first core ring overlap outside the power strap to avoid collision between the pad strap and the second via;
- a first power mesh formed of a fourth metal layer of the wire bond package wherein the first power mesh overlaps the I/O core ring;
- and
- a third via connecting the third metal layer and the fourth metal layer where the first core ring and the first power mesh overlap.
Dependencies are inferred from the claim text.