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US 6,674,165 B2Granted
Mold for a semiconductor chip
AssigneeAsm Technology Singapore Pte Ltd
InventorsShu Chuen Ho, Teng Hock Kuah, Si Liang Lu, Srikanth Narasimulau, Charles J. Vath, III
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Abstract
A mold (1) for a semiconductor chip (9) has two mold halves (2, 3). One mold half (3) includes sealing means (10) adapted to exert a sealing pressure between a surface of the mold and a surface (18) of a substrate (8) located in the mold (1) during a molding operation.
Claims13
A mold for a semiconductor chip comprising:
- two mold halves,
- one mold half comprising a sealing mechanism constructed and configured to exert a sealing pressure between a surface of the mold and a surface of a substrate located in the mold;
- and
- an access open configured to deliver molding material into the mold during a molding operation.
1 more element
A substrate for mounting a semiconductor chip thereon, the substrate comprising:
- a mounting portion adapted to have a semiconductor chip mounted on a first surface of the mounting portion, and
- a second surface of the mounting portion, opposite the first portion, and
- wherein:
- the second surface includes a recess directly on, and extending continuously around the second surface, adjacent to and within the edge of the second surface.
1 more element
Dependencies are inferred from the claim text.