Method of forming dual-implanted gate and structure formed by the same
AssigneeProMOS Technologies Inc.
InventorBenny Yen
Life of this patent
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AssigneeProMOS Technologies Inc.
InventorBenny Yen
Estimating the term…
A method of forming a dual-implanted gate and a structure formed by the same. Stack structures comprising a polysilicon layer, a sacrificial layer and a mask layer are formed over a substrate with a gate oxide layer thereon. A dielectric layer is formed over the substrate covering the stack structures. The dielectric layer is planarized to expose the upper surface of the mask layer in the first and the second structure. The mask layer is removed to form a plurality of trenches. The stack structures are selectively implanted using ions having different electrical states. The sacrificial layer is removed. Thereafter, a barrier layer is formed over the interior surface of the trenches. A metallic layer is formed over the substrate completely filling the trenches. The dielectric layer is removed to form a plurality of gate structures. Spacers may on the sidewalls of the gate structures as well.
A method of forming a dual-implanted gate on a substrate having a gate oxide layer thereon, comprising the steps of:
A method of forming a dual-implanted gate, comprising the steps of:
Dependencies are inferred from the claim text.