Wafer-interposer using a ceramic substrate

An interposer assembly comprising:

• a ceramic substrate having an upper surface and a lower surface, one or more first electrical contacts on the lower surface, one or more second electrical contacts on the upper surface, one or more electrical pathways passing through the ceramic substrate, and connecting the first electrical contacts to the second electrical contacts;
• a semiconductor wafer including one or more semiconductor dies, and having an upper surface and a lower surface, one or more third electrical contacts on the upper surface of the semiconductor wafer, the third electrical contacts being associated with the semiconductor dies,
• wherein the ceramic substrate is operable to remain attached to the semiconductor die after the ceramic substrate and semiconductor wafer are singulated;
• a conductor electrically connecting each first electrical contact with a corresponding third electrical contact;
• and
• a layer of no-flow underfill disposed between the upper surface of the semiconductor wafer and the lower surface of the ceramic substrate.