Methods for fabricating a micro heat barrier

A process for fabricating a micro heat barrier, comprising:

• a) fabricating a plurality of free-standing microsupports on a substrate;
• b) encapsulating the free-standing microsupports in a temporary protective material;
• c) depositing a IR reflective material on top of the temporary protective material;
• and
• d) removing the temporary protective material;
• wherein the IR reflective material comprises alternating layers of IR transparent materials having alternating high and low indices of refraction.

A process for fabricating a multi-layered micro heat barrier, comprising:

• a) fabricating a first plurality of free-standing microsupports on a substrate;
• b) encapsulating the first plurality of free-standing microsupports in a first temporary protective material;
• c) depositing a first reflective membrane comprising an IR reflective material on top of the first layer of temporary protective material;
• d) fabricating a second plurality of freestanding microsupports on the first reflective membrane;
• e) encapsulating the second plurality of free-standing microsupports in a second temporary protective material;
• f) depositing a second reflective membrane comprising an IR reflective material on top of the second layer of temporary protective material;
• g) repeating steps d) through f) until the desired number of reflective membrane layers has been reached;
• and
• h) removing all of the layers of temporary protective material from in-between all of the reflective membrane layers.

A process for fabricating a micro heat barrier, comprising:

• a) providing a dielectric substrate;
• b) depositing a stop layer on top of the substrate;
• c) depositing an etchable material on top of the stop layer;
• d) patterning and etching the etchable material to make a plurality of free-standing microsupports;
• e) encapsulating the free-standing microsupports in a temporary protective material;
• f) depositing a layer of IR reflective material on top of the temporary protective layer;
• and
• g) removing the temporary protective material;
• wherein the etchable material is a material selected from the group consisting of gallium arsenide, silicon dioxide, and silicon.

A process for fabricating a micro heat barrier, comprising:

• a) providing a dielectric substrate;
• b) depositing a stop layer on top of the substrate;
• c) depositing an etchable material on top of the stop layer;
• d) patterning and etching the etchable material to make a plurality of free-standing microsupports;
• e) encapsulating the free-standing microsupports in a temporary protective material;
• f) depositing a layer of IR reflective material on top of the temporary protective layer;
• and
• g) removing the temporary protective material;
• further comprising heating the substrate and using a semi-isotropic dry plasma etch to etch the etchable material, using an active chemical selected from the group consisting of chlorine, fluorine, halogen, and iodide.

A process for fabricating a micro heat barrier, comprising:

• a) providing a silicon wafer;
• b) creating an etch stop layer on the silicon wafer;
• c) depositing a structural layer on top of the etch stop layer;
• d) patterning and etching the backside of the silicon wafer down to the etch stop layer, thereby creating a gap and a microframe made of silicon, whereby the structural layer is exposed;
• e) removing the etch stop layer;
• and
• f) depositing an IR reflective material on at least one side of the structural layer.