Method and apparatus for surface processing of printed wiring board

A surface-processing apparatus for a multilayer printed wiring board comprising:

• means for etching the surface of a conductor pattern formed on at least one outer layer of a printed wiring board;
• first rinsing means for rinsing the surface of the printed wiring board the conductor pattern of which has been etched by said etching means;
• air bubble removing means for removing air bubbles affixed to the surface of the printed wiring board by immersing the printed wiring board rinsed by said first rinsing means in a water-soluble pre-flux liquid in a processing vessel;
• pre-flux forming means for forming a pre-flux film on said conductor pattern of said outer layer of said printed wiring board in the pre-flux liquid, freed of air bubbles by said air bubble removing means, using an in-liquid spray provided in said pre-flux liquid in said processing vessel;
• liquid removing means for removing the pre-flux liquid from the surface of said printed wiring board carrying said pre-flux film;
• and
• second rinsing means for rinsing the surface of said printed wiring board from the surface of which said pre-flux liquid has been removed by said liquid removing means.