Package retention module coupled directly to a socket

A retention module, comprising:

• a socket to directly connect to a package, wherein the socket is a single piece;
• a first retention arm and a second retention arm coupled to the socket, each perpendicular to the socket;
• and
• at least two retention clamps, a first retention clamp coupled to the first retention arm and a second retention clamp coupled to the second retention arm, to secure placement of a heat sink against a surface of a package assembly, wherein the first retention arm, the first retention clamp, the second retention arm, the second retention clamp and the socket are monolithic.

A package system, comprising:

• a package assembly;
• and
• a retention module, including:
• a socket to directly interconnect a package and a motherboard, wherein the socket is a single piece,
• at least one retention arm coupled to the socket, perpendicular to the socket, and
• at least one retention clamp coupled to the at least one retention arm to secure placement of a heat sink against the package assembly, wherein the at least one retention arm, the at least one retention clamp and the socket are monolithic.

A method of retaining a heat sink to a package, comprising:

• coupling a socket directly to a motherboard, wherein the socket is a single piece, and at least one retention arm is coupled to the socket, perpendicular to the socket;
• coupling a package directly to the socket;
• coupling an integrated heat spreader (IHS) lid to the package;
• and
• coupling a heat sink to the IHS lid, wherein at least one retention clamp is coupled to the at least one retention arm to secure placement of the heat sink against the IHS lid, and wherein the at least one retention arm, the at least one retention clamp and the socket are monolithic.

A method of retaining a heat sink to a package, comprising:

• coupling a socket directly to a motherboard, wherein the socket is a single piece, and at least one retention arm is coupled to the socket, perpendicular to the socket;
• coupling a package directly to the socket;
• and
• coupling a heat sink to the package, wherein at least one retention clamp is coupled to the at least one retention arm to secure placement of the heat sink against the package, wherein the at least one retention arm, the at least one retention clamp, and the socket are monolithic.