Back to results
US 6,672,880 B2Granted
Laminated socket contacts
AssigneeIntel Corporation
InventorsHong Xie, Ram Viswanath, PR Patel
Life of this patent
Estimating the term…
Abstract
A laminated socket contact is described for reducing inductance in power connections to an integrated circuit package. The contact consists of a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel layer, and at least one conductive finger extending from each of the power panel and ground panel. Various embodiments of this socket contact may be used with power bar connectors, side terminal connectors or pin connectors.
Claims24
A socket comprising:
- a conductive power panel;
- a conductive ground panel;
- a thin non-conductive layer interposed between the power panel and ground panel;
- a socket body encompassing the power panel, ground panel, and non-conductive layer;
- a plurality of conductive fingers extending from the power panel;
- and
- a plurality of conductive fingers extending from the ground panel, wherein the fingers of the power panel pass over and between the fingers of the ground panel, and the conductive fingers of the ground panel extending in the same direction as the conductive fingers of the power panel to engage segments of a power bar on an integrated circuit package.
4 more elements
A socket comprising:
- a conductive power panel;
- a conductive ground panel;
- a thin non-conductive layer interposed between the power panel and ground panel;
- a socket body encompassing the power panel, ground panel, and non-conductive layer;
- a plurality of conductive fingers extending from the power panel;
- and
- a plurality of conductive fingers extending from the ground panel and passing over and between the fingers of the power panel, the conductive fingers of the ground panel extending in the same direction as the conductive fingers of the power panel to engage segments of a power bar on an integrated circuit package.
4 more elements
A socket comprising:
- a conductive power panel;
- a conductive ground panel;
- a thin non-conductive layer interposed between the power panel and the ground panel;
- a socket body encompassing the power panel, ground panel, and non-conductive layer;
- and
- a conductive finger extending from each of the power panel and the ground panel in the same direction and positioned to engage side terminals on an integrated circuit package each successive side terminal alternately to conduct power and ground.
3 more elements
An apparatus comprising:
- a printed circuit board;
- and
- a socket mounted on the printed circuit board, the socket comprising a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel, a socket body encompassing the power panel, ground panel, and non-conductive layer, a plurality of conductive fingers extending from the power panel, and a plurality of conductive fingers extending from the ground panel, the fingers of the power panel passing over the ground panel and between the fingers of the ground panel, and the conductive fingers of the ground panel extending in the same direction as the conductive fingers of the power panel to engage segments of a power bar on an integrated circuit package.
An apparatus comprising:
- a printed circuit board;
- and
- a socket mounted on the printed circuit board, the socket comprising a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and ground panel, a socket body encompassing the power panel, ground panel, and non-conductive layer, a plurality of conductive fingers extending from the power panel, and a plurality of conductive fingers extending from the ground panel passing over the power panel and between the fingers of the power panel, the conductive fingers of the ground panel extending in the same direction as the conductive fingers of the power panel to engage segments of a power bar on an integrated circuit package.
An apparatus comprising:
- a printed circuit board;
- and
- a socket mounted on the printed circuit board, the socket comprising a conductive power panel, a conductive ground panel, a thin non-conductive layer interposed between the power panel and the ground panel, a socket body encompassing the power panel, ground panel, and non-conductive layer, and a conductive finger extending from each of the power panel and the ground panel in the same direction and positioned to engage side terminals on an integrated circuit package each successive side terminal alternately to conduct power and ground.
Dependencies are inferred from the claim text.