Atomic layer deposition method using a novel group IV metal precursor
AssigneeSamsung Electronics Co., Ltd.
InventorsYo Sep Min, Dae Sig Kim, Young Jin Cho, Jung Hyun Lee
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Abstract
An atomic layer deposition method which comprises forming a metal oxide thin film by using, as a group IV metal precursor, a complex of a formula M(L)2 in which M is a group IV metal ion having a charge of +4 and L is a tridentate ligand having a charge of −2, the ligand being represented by the following formula (I): wherein each of R1 and R2, independently, is a linear or branched C1-4 alkyl group; and R3 is a linear or branched C1-5 alkylene group. The group IV metal precursor exhibits excellent thermal and chemical stabilities under a carrier gas atmosphere, whereas it has high reactivity with a reaction gas.
Claims4
An atomic layer deposition method which comprises forming a metal oxide thin film by using, as a group IV metal precursor, a complex of a formula M(L)2 in which M is a group IV metal ion having a charge of +4 and L is a tridentate ligand having a charge of −2, the ligand being represented by the following formula (I):
- wherein each of R1 and R2, independently, is a linear or branched C1-4 alkyl group;
- and R3 is a linear or branched C1-5 alkylene group.
Dependencies are inferred from the claim text.