Resin diamond blade and optical waveguide manufacturing method using the blade
AssigneeFujitsu Limited
InventorsAkio Maeda, Takashi Shiotani
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Abstract
A silicon base optical waveguide manufacturing method including the steps of preparing a silicon wafer having a plurality of embedded optical waveguides, performing first-stage dicing of the silicon wafer to form a cut groove by using a first resin diamond blade having a thickness t1, and performing second-stage dicing of the silicon wafer along the cut groove to polish an end face of each optical waveguide by using a second resin diamond blade having a thickness t2 greater than the thickness t1. The second resin diamond blade includes diamond abrasive grains having a grain diameter of 2 μm or less, and the relation between the thicknesses t1 and t2 is set to t1+0.01 mm≦t2≦t1+0.05 mm.
Claims11
A silicon base optical waveguide manufacturing method comprising the steps of:
- performing first-stage dicing of a silicon wafer having a silicon substrate and a plurality of optical waveguides formed on said silicon substrate to form a cut groove by using a first resin diamond blade having a thickness t1;
- and
- performing second-stage dicing of said silicon wafer along said cut groove to polish an end face of each of said optical waveguides by using a second resin diamond blade having a thickness t2 greater than said thickness t1;
- said second resin diamond blade including diamond abrasive grains having a grain diameter of 2 μm or less;
- the relation between said thickness t1 and said thickness t2 being set to t1+0.01 mm≦t2≦t1+0.05 mm.
A silicon base optical waveguide manufacturing method comprising the steps of:
- bonding a first silicon wafer having a plurality of optical waveguides on a second silicon wafer;
- performing first-stage dicing of said first and second silicon wafers to form a first cut groove by using a first resin diamond blade having a thickness t1;
- and
- performing second-stage dicing of said first and second silicon wafers along said first cut groove to form a second cut groove shallower than said first cut groove by using a second resin diamond blade having a thickness t2 greater than said thickness t1;
- said second resin diamond blade including diamond abrasive grains having a grain diameter of 2 μm or less.
A resin diamond blade comprising:
- diamond abrasive grains having a grain diameter of 2 μm or less;
- cerium oxide abrasive grains having an average grain diameter of 0.1 to 5.0 μm and a purity of 35 to 95 wt %;
- a bonding resin for bonding said diamond abrasive grains and said cerium oxide abrasive grains;
- the total content of said diamond abrasive grains and said cerium oxide abrasive grains with respect to the volume of said resin diamond blade being 20 to 40 vol %;
- and
- the content of said cerium oxide abrasive grains with respect to the total volume of said diamond abrasive grains and said cerium oxide abrasive grains being 35 to 70 vol %.
Dependencies are inferred from the claim text.