Heat sink with multiple surface enhancements

A method of cooling an electronic device, said method including the steps of:

• providing a heat sink of the type comprising a base plate having a top surface and a bottom surface, wherein a plurality of vertical plates are affixed to and extending substantially perpendicularly from the base plate top surface in a parallel spaced apart manner, and including at least one primary fin affixed to the top surface of the base plate and interposed between each pair of adjacent vertical plates wherein the primary fin is substantially parallel to the vertical plates and extends from the base plate to a height less than the vertical plates and a secondary fin affixed to and extending between an upper portion of each adjacent pair of vertical plates, the lower portion of each adjacent pair of vertical plates and the bottom of the secondary fin defining a primary passageway at each end of the heat sink above the base place, the secondary fin having a top convoluted edge and a bottom convoluted edge and oriented such that the bottom convoluted edge faces the base plate top surface, and further including a plurality of individual fins formed in a convoluted accordion-like manner defining a plurality of secondary fin passageways between adjacent ones of the individual fins with the secondary fin arranged in an arcuate manner such that a top edge thereof is concave with respect to a top edge of the vertical plates and a bottom edge thereof is convex to the top surface of the base plate;
• affixing the bottom surface of the heat sink to the electronic device;
• attaching a fan to a top of the heat sink;
• causing the fan to draw air into the primary passageways and through the plurality of secondary fin passageways.