Arrangement for subjecting a bonding wire to a mechanical load
AssigneeSiemens Aktiengesellschaft
InventorNorbert Seliger
Life of this patent
Estimating the term…
Abstract
An arrangement in which a first contact surface (2) for bonding one end (51) of the bonding wire (5) and a piezoelectric actuator (3) are fixed on a support body (1) and a second contact surface (4) for bonding another end (52) of the bonding wire (5) is fixed to the actuator by an unsupported support body (34). The second contact surface moves back and forth in relation to the support body by means of an actuator, at a frequency of between 0.1 Hz and a few KHz and in one or more directions (31, 31′, 31″). The arrangement is suitable for use in testing the endurance of bonding wire connections.
Claims8
Arrangement for producing a mechanical load on a bonding wire (5), which comprises:
- a carrier body (1),
- a first contact surface (2) which is fixed relative to the carrier body (1) for attachment by bonding one end (51) of the bonding wire (5),
- a piezoelectric actuator (3) which is mounted on a carrier body (1) and which can expand and contract relative to the carrier body (1) and in the direction (31) to the first contact surface (2) with a frequency of at least 0.1 Hz,
- a second contact surface (4) attached to the actuator (3) for attachment by bonding the other end (52) of the bonding wire (5) which moves back and forth upon expansion and contraction of the actuator (3) relative to the carrier body (1) and in the direction (31) to the first contact surface (2) with the frequency of this expansion and contraction.
Arrangement for producing a mechanical load on a bonding strip (5), which comprises:
- a carrier body (1),
- a first contact surface (2) which is fixed relative to the carrier body (1) for attachment by bonding one end (51) of the bonding strip (5),
- a piezoelectric actuator means (3, 3′) which is mounted on a carrier body (1) and which can expand and contract relative to the carrier body (1) at least one direction (31;
- 31″, 31′, 31) and
- a second contact surface (4) attached to the actuator means (3, 3′) for attachment by bonding the other end (52) of the bonding strip (5) which moves back and forth relative to the carrier body (1) in one direction (31;
- 31″, 31′, 31) when the actuator means (3, 3′) expands and contracts,
- the second contact surface (4) being held on a support body (34) which is attached to the actuator means (3, 3′) and which moves back and forth during expansion and contraction of the actuator means (3, 3′) relative to the carrier body (1).
Arrangement for producing a mechanical load on a bonding strip (5), which comprises:
- a carrier body (1),
- a first contact surface (2) which is fixed relative to the carrier body (1) for attachment by bonding one end (51) of the bonding strip (5),
- a piezoelectric actuator means (3′) which is mounted on a carrier body (1) and which can expand and contract relative to the carrier body (1) independently in at least two different directions (31, 31′, 31″), and
- a second contact surface (4) attached to the actuator means (3′) for attachment by bonding the other end (52) of the bonding strip (5) which moves back and forth relative to the carrier body (1) in each direction (31, 31′, 31″) in which the actuator means (3′) expands and contracts.
Dependencies are inferred from the claim text.