Synthetic resin capping layer on a printed circuit
AssigneeKoninklijke Philips Electronics N.V.
InventorsReinhold Wimberger Friedl, Egbert Broeksema, Henricus A.C. Deeben
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Abstract
A printed circuit is provided with a synthetic resin capping layer that exhibits a continuous variation of mechanical properties in a direction at right angles to its surface. The printed circuit can be in a mobile telephone or other portable device, and the capping layer of the printed circuit can optionally constitute the housing of the device.
Claims5
A printed circuit which is provided with a synthetic resin capping layer, said circuit comprising a printed circuit board having at least one electric component, and the capping layer comprising a foam-forming reactive injection-moulding material exhibiting a variation of mechanical properties in a direction at right angles to a surface of the capping layer, characterized in that said variation of the mechanical properties comprises a continuous increase in hardness of the capping layer.
A mobile telephone comprising a housing in which a printed circuit is arranged, characterized in that the printed circuit is provided with a synthetic resin capping layer having a continuously varying hardness and comprising a foam-forming reactive injection-moulding material which constitutes the housing of the mobile telephone.
Dependencies are inferred from the claim text.