Power supply apparatus
AssigneeSansha Electric Manufacturing Company, Limited
InventorsKunio Shikata, Masao Katooka, Yoshimasa Kawashima, Hideo Ishii
Life of this patent
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Abstract
A power supply apparatus has chassis (42, 44) mounted on opposing surfaces of a heat sink (40). Printed circuit boards (46, 48) are disposed outward of the chassis (42, 44) and detachably secured to the chassis (42, 44). Semiconductor modules (4, 16a, 16b, 32) are mounted on the respective surfaces of the heat sink (40) facing toward the printed circuit boards (46, 48) and extend through the chassis (42, 44). The semiconductor modules (4, 16a, 16b, 32) are electrically connected to the printed circuit boards (46, 48) to form a power supply circuit.
Claims9
A power supply apparatus comprising:
- first and second spaced apart chassis;
- a heat sink disposed between said first and second chassis, said first and second chassis being mounted to said heat sink;
- a printed circuit board detachably mounted to a surface of at least one of said first and second chassis opposite to a surface of said at least one chassis facing said heat sink;
- and
- at least one semiconductor module, said at least one, semiconductor module being mounted on the surface of said heat sink facing toward said printed circuit board and electrically connected to said printed circuit board to form a power supply circuit.
Dependencies are inferred from the claim text.