Electrostatic chuck apparatus and method for efficiently dechucking a substrate therefrom

A method for fabricating a substrate comprising:

• providing a fabrication tool comprising:
• an electrostatically energizable substrate plate sized to accommodate a substrate;
• and
• an electrically conductive lift pin movably positionable with respect to the electrostatically energizable substrate plate such as to optionally contact and lift the substrate when positioned upon the electrostatically energizable substrate plate, the electrically conductive lift pin being connected to ground through a switch;
• positioning the substrate upon the electrostatically energizable substrate plate with the electrically conductive lift pin not contacting the substrate and the switch open, while electrostatically energizing the electrostatically energizable substrate plate and inducing a complementary charge within the substrate absent direct charge introduction into the substrate through the electrically conductive lift pin;
• fabricating the substrate while employing the fabrication tool with the electrostatically energizable substrate plate electrostatically energized, the lift pin not contacting the substrate and the switch open;
• and
• repositioning the electrically conductive lift pin to contact the substrate, while closing the switch.