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US 6,664,779 B2Granted
Package with environmental control material carrier
AssigneeTexas Instruments Incorporated
InventorsVincent C. Lopes, Jwei Wien Liu
Life of this patent
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AssigneeTexas Instruments Incorporated
InventorsVincent C. Lopes, Jwei Wien Liu
Estimating the term…
A drop-in environmental control material carrier assembly 55, which improves the performance and lowers the cost of semiconductor packages. The environmental control materials are positioned inside the package cavity by means of a drop-in environmental control material carrier assembly 54, which can hold up to eight materials. Three types of environmental control materials are typically used in micromirror packages: (1) one for absorbing moisture inside the package, (2) one for absorbing adhesive outgassing constituents inside the package, and (3) one for storing the PFDA lubricant used to prevent the micromirror mirrors from sticking. The performance and lifetime of the micromirror devices are improved and the cost of projection display systems, in which these micromirrors are central components, is lowered.
A semiconductor package, comprising:
A semiconductor package comprising:
A semiconductor package, comprising:
Dependencies are inferred from the claim text.