Wiring structure for an integrated circuit
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsAkihiko Ohsaki, Masahiko Fujisawa, Noboru Morimoto
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Abstract
A wire width and a wiring space of each of signal wires 1 and ground/power wires 2 are determined to be a wire width W1 (the minimum wire width) and a wiring space S1, respectively. A wire width and a wiring space of the via-hole neighboring region 1a or 2a are determined to be a wire width W2 (>W1) and a wiring space S2 (<S1), respectively. The wire widths W1 and W2 and the wiring spaces S1 and S2 are respectively determined so as to maintain the minimum wiring pitch P. The wiring space S1 is determined also so as to satisfy {S1/P≧0.6}. Further, the signal wires 1 and the ground/power wires 2 have the same wire thickness of a wire thickness T1 which allows an aspect ratio (T1/W1) to be equal to, or higher than, 2.
Claims5
An integrated circuit having a wiring structure including a plurality of signal wires and a plurality of ground/power wires which maintain a predetermined minimum wiring pitch, said signal wires and said plurality of ground/power wires each having main parts and other parts at via-hole neighboring regions, wherein
- a ratio of a wiring space between said main parts of every two adjacent ones of said plurality of signal wires to said predetermined minimum wiring pitch is equal to, or higher than, 0.6, and
- said main parts of said plurality of signal wires and said plurality of ground/power wires have a same wire thickness, and said main parts of said plurality of signal wires have an aspect ratio equal to, or higher than, 2, said aspect ratio being a ratio of said wire thickness to a minimum wire width of said wires.
Dependencies are inferred from the claim text.