Flexible printed circuit board
AssigneeFujikura Ltd.
InventorsNobuo Tanabe, Kenichi Okada, Yukihiko Kurosawa, Takayuki Imai, Sadamitsu Jumonji, Masahiko Arai, Masahiro Kaizu
Life of this patent
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Abstract
A flexible printed circuit board (FPC) comprises a base film; a base film side adhesive layer provided on the base film; a metal foil layer on which a pattern circuit is formed, provided on the base film side adhesive layer; and a cover layer side adhesive layer provided on the metal foil layer, wherein at least one of the base film side adhesive and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, so that the FPC has a stable flexibility at high temperature.
Claims15
A flexible printed circuit board comprising a base film;
- a base film side adhesive layer provided on the base film;
- a metal foil layer on which pattern circuit is formed, provided on the base film side adhesive layer;
- and a cover layer side adhesive layer provided on the metal foil layer,
- wherein at least one of the base film side adhesive layer and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, and
- wherein a reciprocation number N indicating a bending life of the flexible printed circuit board is at least ten million times at 60° C.
A flexible printed circuit board comprising a base film;
- a base film side adhesive layer provided on the base film;
- a metal foil layer on which pattern circuit is formed, provided on the base film side adhesive layer;
- and a cover layer side adhesive layer provided on the metal foil layer,
- wherein at least one of the base film side adhesive layer and the cover layer side adhesive layer has a higher glass transition temperature than an operating temperature of the flexible printed circuit board, and
- wherein a reciprocation number N indicating a bending life of the flexible printed circuit board is between a million times and ten million times at 80° C.
Dependencies are inferred from the claim text.