Apparatus and method for shielding electromagnetic radiation
AssigneeUnisys Corporation
InventorsMark R. Treiber, Peter Klein, Grant M. Smith
Life of this patent
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Abstract
An apparatus is provided for dissipating heat from an electronic component, such as a processor, that is mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component. The apparatus includes a heat sink that is configured to be mounted to a surface of the electronic component. The apparatus also includes a conductor connected to the heat sink. The conductor is configured to provide electrical contact between the heat sink and a surface of the conductive enclosure. Accordingly, the apparatus at least partially shields the electromagnetic radiation generated by the electronic component. A corresponding method is also provided.
Claims2
An apparatus for dissipating heat from an electronic component mounted in a conductive enclosure and for shielding electromagnetic radiation generated by the electronic component, said apparatus comprising:
- a heat sink configured to be positioned adjacent a surface of the electronic component;
- and
- a conductor connected to said heat sink;
- said conductor forming an electrical contact extending from said heat sink and configured to provide electrical contact between said heat sink and a surface of the conductive enclosure, said heat sink being a shield for at least a portion of the electromagnetic radiation generated by the electronic component,
- said conductor being pivotally coupled to said heat sink;
- and
- a fastener pivotally coupling said conductor to said heat sink,
- said fastener comprising a rivet defining an axis about which said conductor pivots.
An assembly for shielding electromagnetic radiation generated by a processor, said assembly comprising:
- a processor configured to be mounted within a conductive enclosure;
- a heat sink mounted to said processor for dissipating heat from said processor, said heat sink comprising a base portion configured for contact with said processor and heat transfer fins extending from said base portion;
- and
- a conductor pivotally coupled to said base portion of said heat sink;
- said conductor forming an electrical contact extending from said base portion of said heat sink and configured to provide electrical contact between said heat sink and a surface of the conductive enclosure, said heat sink being a shield for at least a portion of the electromagnetic radiation generated by said processor;
- and
- a fastener pivotally coupling said conductor to said heat sink,
- said fastener comprising a rivet defining an axis about which said conductor pivots.
Dependencies are inferred from the claim text.